Curable resin composition and method for suppressing curing shrinkage of curable resin composition
AssigneeAdeka Corporation
InventorsTakeshi Endo, Junji Ueyama, Ryo Ogawa
Life of this patent
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Abstract
Provided is a curable resin composition exhibiting reduced or controlled shrinkage on curing. The composition includes (A) an epoxy resin, (B) a latent curing agent, and (C) a compound represented by formula (1): wherein X is an oxygen atom or a sulfur atom; R1 and R2 each independently represent a hydrogen atom, an alkyl group, or an aryl group; and R3 and R4 each independently represent a hydrogen atom, an alkyl group, or an aryl group, or R3 and R4 are connected to each other to represent a divalent group to form a ring.
Claims13
A curable resin composition comprising:
- (A) an epoxy resin, (B) a latent curing agent, (C) at least one compound selected from U-1, U-4, U-5, U-6, U-10, U-12, and U-13 shown below:
- and (D) a cyanate ester resin.
A method for reducing or controlling shrinkage of a cured product obtained from a curable resin composition comprising (A) an epoxy resin and (B) a latent curing agent, the method comprising curing the resin composition in the presence of (C) at least one compound selected from U-1, U-4, U-5, U-6, U-10, U-12, and U-13 shown below:
- wherein the curable resin composition further comprises (D) a cyanate ester resin.
Dependencies are inferred from the claim text.