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US 12,590,012 B2Granted
Negative thermal expansion material and composite material
AssigneeNippon Chemical Industrial Co., Ltd.
InventorsTakuma Kato, Junya Fukazawa, Toru Hata
Life of this patent
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Abstract
An object of the present invention is to provide a negative thermal expansion material having better negative thermal expansion characteristics. The present invention is a negative thermal expansion material, comprising a copper vanadium composite oxide represented by the following general formula (1): CuxCayVzOt. In the general formula (1), 0<x<2.50, 0<y<2.00, 1.70≤z≤2.30, 6.00≤t≤9.00, and 1.00≤x+y≤3.00.
Claims15
A negative thermal expansion material, comprising a copper vanadium composite oxide represented by the following general formula (1):
- CuxCayVzOt (1)
- wherein 1.50≤x≤2.20, 0<y≤0.40, 1.70≤z≤2.30, 6.00≤t≤9.00, and 1.50<x+y≤2.60, wherein the copper vanadium composite oxide has a crystal structure with a single phase of a ziesite phase (β-phase) or a mixed phase of the ziesite phase (β-phase) and a blossite (α-phase) derived from Cu2V2O7.
Dependencies are inferred from the claim text.