Liquid ejecting head manufacturing method, liquid ejecting head, and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorHaruki Kobayashi
Life of this patent
Estimating the term…
Loading patent…
AssigneeSeiko Epson Corporation
InventorHaruki Kobayashi
Estimating the term…
There is provided a liquid ejecting head manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head that includes a first head chip ejecting a liquid, and a flow path structure having a first selection coupling portion and a second selection coupling portion that are flow path coupling portions to the first head chip, the method including: a replacing step of replacing the first head chip with a second head chip compatible with the first head chip, in which the replacing step includes a first step of releasing an adhesion state where the first selection coupling portion and the first head chip are liquid-tightly coupled, and a second step of liquid-tightly coupling the second selection coupling portion compatible with the first selection coupling portion and the second head chip by an adhesive.
A liquid ejecting head manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head that includes a first head chip configured to eject a liquid, and a flow path structure having a first selection coupling portion and a second selection coupling portion that are flow path coupling portions to the first head chip, the method comprising:
A liquid ejecting head manufacturing method of manufacturing a second liquid ejecting head by reusing a portion of a first liquid ejecting head that includes a first flow path structure, and a head chip having a first chip-side coupling portion and a second chip-side coupling portion that are flow path coupling portions to the first flow path structure, the method comprising:
Dependencies are inferred from the claim text.