Apparatus and method for manufacturing semiconductor structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChun-Hsi Huang
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Abstract
An apparatus and a method for forming a semiconductor structure are provided. The apparatus includes a polishing pad, a polishing head and a temperature control module. The polishing head mounts a substrate against the polishing pad. The temperature control module faces the polishing pad. The temperature control module includes a first temperature controller and a second temperature controller. The first temperature controller is configured to control a first temperature of a first zone of the polishing pad. The second temperature controller is configured to control a second temperature of a second zone of the polishing pad.
Claims20
A method for forming a semiconductor structure, comprising:
- receiving a substrate;
- mounting the substrate on a polishing head with a side of the substrate facing a polishing pad;
- measuring a temperature distribution of the polishing pad;
- and
- adjusting the temperature distribution of the polishing pad through a temperature control module, wherein the temperature control module faces the polishing pad, and the temperature control module comprises:
- a first temperature controller, configured to adjust a first temperature of a first zone of the polishing pad by heating or cooling the polishing pad in a non-contact manner;
- a second temperature controller, configured to adjust a second temperature of a second zone of the polishing pad by heating or cooling the polishing pad in a non-contact manner;
- a first temperature sensor, configured to detect the first temperature of the first zone of the polishing pad, wherein a vertical projection of the first temperature controller on the polishing pad encompasses a vertical projection of the first temperature sensor on the polishing pad;
- and
- a second temperature sensor, configured to detect the second temperature of the second zone of the polishing pad, wherein a vertical projection of the second temperature controller on the polishing pad encompasses a vertical projection of the second temperature sensor on the polishing pad.
A method for forming a semiconductor structure, comprising:
- grinding of a first substrate by a polishing pad;
- measuring a first surface profile of the first substrate;
- adjusting a temperature distribution of the polishing pad in response to the first surface profile of the first substrate by heating or cooling the polishing pad in a non-contact manner, wherein the temperature distribution is obtained by temperature sensors positioned adjacent to respective temperature controllers, wherein the temperature sensors are configured to detect temperatures of different zones of the polishing pad, and a vertical projection of the temperature controllers on the polishing pad encompasses a vertical projection of the respective temperature sensors on the polishing pad;
- and
- grinding of a second substrate by the polishing pad while controlling the temperature distribution of the polishing pad based on the adjusted temperature distribution.
A method for forming a semiconductor structure, comprising:
- polishing a substrate by a polishing pad;
- measuring a temperature distribution of the polishing pad;
- and
- adjusting the temperature distribution of the polishing pad through a temperature control module in response to a surface profile of the substrate, wherein the temperature control module comprises temperature controllers and temperature sensors adjacent to respective temperature controllers, each of the temperature controllers respectively configured to adjust a temperature of one of zones of the polishing pad by heating or cooling the polishing pad in a non-contact manner, and each of the temperature sensors respectively configured to detect the temperature of a corresponding zone of the polishing pad, wherein a vertical projection of the temperature controllers on the polishing pad encompasses a vertical projection of the respective temperature sensors on the polishing pad.
Dependencies are inferred from the claim text.