Ultrasonic treatment device

An ultrasonic treatment device, comprising an ultrasonic treatment tip and a cooling or heating mechanism, wherein

• the ultrasonic treatment tip comprises a sealed cavity, a sound-transferring medium disposed inside the sealed cavity, a treatment window and a heat-transferring surface;
• the ultrasonic treatment tip is configured for outputting ultrasonic waves to a treatment area through the treatment window;
• the heat-transferring surface is intimately surrounding the treatment window, and thermally contacted with the treatment area;
• and
• the cooling or heating mechanism is configured to discharge heat generated at the treatment area outside of the ultrasonic device by thermally contacting the heat-transferring surface or generate heat at least partially overlapped with heat of the ultrasonic waves on a same target tissue,
• wherein the cooling or heating mechanism comprises a semiconductor assembly, and the semiconductor assembly comprises a semiconductor sheet, a heat-transferring member and a heat-dissipating member;
• a cold end of the semiconductor sheet is tightly attached with the heat-transferring surface, and a hot end of the semiconductor sheet is tightly attached with the heat-transferring member;
• a heat exchange end of the heat-transferring member away from the semiconductor sheet is connected to the heat-dissipating member.