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US 12,588,843 B2Granted
Sensor with substrate including integrated electrical and chemical components and methods for fabricating the same
AssigneeMedtronic MiniMed, Inc.
InventorsEllis Garai, Akhil Srinivasan, David C. Antonio
Life of this patent
Estimating the term…
Abstract
Analyte sensor devices and methods for fabricating analyte sensor devices are presented here. In accordance with certain embodiments, a device for detecting and/or measuring one or more analytes in fluid includes a substrate and one or more analyte sensors disposed on and/or in the substrate. Further, the device includes an integrated circuit disposed on and/or in the substrate. The integrated circuit is electrically integrated with the analyte sensors.
Claims29
A device for detecting and/or measuring one or more analytes in fluid, the device comprising:
- a substrate comprising an integrated circuit region, an analyte sensor region, and an interconnecting region, wherein the analyte sensor region has a distal end, a proximal end contacting the interconnecting region, and a length dimension extending from the distal end to the proximal end, wherein the distal end and the length dimension are surrounded by a void in the substrate and are separated from the integrated circuit region by the void, wherein the void in the substrate extends along a straight direction along the substrate from the distal end to the proximal end of the analyte sensor region, wherein the proximal end is at a center axis of the substrate;
- at least one analyte sensor disposed on and/or in the substrate in the analyte sensor region, wherein the at least one analyte sensor is configured to extend in the straight direction from the proximal end to the distal end along the length dimension in an unbent configuration and is configured to be bent or pivoted away from the straight direction;
- and
- an integrated circuit disposed on and/or in the substrate in the integrated circuit region, wherein the integrated circuit is electrically integrated with the at least one analyte sensor.
1 more element
A method for fabricating an analyte sensor device, the method comprising:
- forming conductive circuitry on and/or in a substrate that has an integrated circuit region, and an analyte sensor region;
- forming at least one integrated circuit device on and/or in the integrated circuit region of the substrate, wherein the at least one integrated circuit device is selectively electrically connected to the conductive circuitry;
- depositing chemistry layers on and/or in the analyte sensor region of the substrate to form at least one analyte sensor integrated into the conductive circuitry, wherein the integrated circuit device and the analyte sensor form the analyte sensor device, the analyte sensor region having a distal end, a proximal end, and a length dimension extending from the distal end to the proximal end;
- and
- cutting the substrate to form a void in the substrate surrounding the distal end and extending along the length dimension from the distal end to the proximal end of the analyte sensor region, wherein the void extends along a straight direction along the substrate from the distal end to the proximal end of the analyte sensor region, wherein the void partially separates the at least one analyte sensor from the at least one integrated circuit device within the analyte sensor device, wherein the proximal end is at a center axis of the substrate wherein the at least one analyte sensor is configured to extend in the straight direction from the proximal end to the distal end along the length dimension in an unbent configuration and is configured to be bent or pivoted away from the straight direction.
2 more elements
A method for fabricating analyte sensor devices, the method comprising:
- providing a sheet of a substrate;
- forming conductive circuitry on and/or in the substrate in selected locations;
- forming at least one integrated circuit device on and/or in an integrated circuit region of the substrate in each location, wherein each integrated circuit device is selectively electrically connected to respective circuitry therein;
- depositing electrochemical sensing layers on and/or in an analyte sensor region of the substrate to form an analyte sensor in each location, wherein each analyte sensor is integrated with a respective integrated circuit device to form a respective analyte sensor device, the analyte sensor region in each location having a distal end, a proximal end, and a length dimension extending from the distal end to the proximal end;
- cutting the substrate to form a void in the substrate surrounding the distal end and extending along the length dimension from the distal end to the proximal end of the analyte sensor region in each location, wherein the void partially separates the analyte sensor from the rest of the substrate at each location, wherein the void extends along a straight direction along the substrate from the distal end to the proximal end of the analyte sensor region, wherein the proximal end is at a center axis of the substrate wherein the analyte sensor is configured to extend in the straight direction from the proximal end to the distal end along the length dimension in an unbent configuration and is configured to be bent or pivoted away from the straight direction, wherein within each analyte sensor device the analyte sensor is separated from the at least one integrated circuit device;
- and
- cutting the sheet to separate each analyte sensor device.
4 more elements
Dependencies are inferred from the claim text.