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US 12,588,564 B2Granted
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsAkira Hirao, Yoshinari Ikeda, Motohito Hori
Life of this patent
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Abstract
A semiconductor device includes: an insulated circuit substrate including a conductive plate on a top surface side; a semiconductor chip mounted on the conductive plate; and an external connection terminal electrically connected to the semiconductor chip and including an inner-side conductor layer, an outer-side conductor layer provided at a circumference of the inner-side conductor layer, and an insulating layer interposed between the inner-side conductor layer and the outer-side conductor layer.
Claims18
A semiconductor device comprising:
- an insulated circuit substrate including a conductive plate on a top surface side;
- a semiconductor chip mounted on the conductive plate;
- and
- an external connection terminal electrically connected to the semiconductor chip and including an inner-side conductor layer, an outer-side conductor layer provided at a circumference of the inner-side conductor layer, and an insulating layer interposed between the inner-side conductor layer and the outer-side conductor layer.
1 more element
Dependencies are inferred from the claim text.