Dual sided molded package with varying interconnect pad sizes and varying exposed solderable area

A wireless device comprising:

• a circuit board having a plurality of metal pads including one or more first metal pads and one or more second metal pads, the one or more first metal pads having a larger surface area than a surface area of the second metal pads;
• and
• a dual sided molded package mounted on the circuit board, the dual sided molded package including a substrate having a first side and an opposite second side, a plurality of pads attached to the second side of the substrate and including one or more first pads having a first surface area and one or more second pads having a second surface area that is smaller than the first surface area, and a plurality of electrically conductive interconnect members attached to the plurality of pads and including one or more first interconnect members attached to the one or more first pads and having a first solderable area and one or more second interconnect members attached to the one or more second pads and having a second solderable area, the first solderable area being substantially equal to the first surface area and the second solderable area being substantially equal to the second surface area, the dual sided molded package further including an overmold on the second side of the substrate, and a gap between the overmold and the plurality of electrically conductive interconnect members, the first interconnect members and the second interconnect members being connected to the first metal pads and the second metal pads, respectively, the first solderable area being substantially equal to the surface area of the first metal pads, the second solderable area being substantially equal to the surface area of the second metal pads.

A package module comprising:

• a substrate;
• a package attached to a first side of the substrate;
• a plurality of pads attached to a second side of the substrate opposite the first side and including one or more first pads having a first surface area and one or more second pads having a second surface area that is smaller than the first surface area;
• a plurality of electrically conductive interconnect members attached to the plurality of pads and including one or more first interconnect members attached to the one or more first pads and having a first solderable area and one or more second interconnect members attached to the one or more second pads and having a second solderable area, the first solderable area being substantially equal to the first surface area and the second solderable area being substantially equal to the second surface area;
• an overmold on the second side of the substrate;
• and
• a gap between the overmold and the plurality of electrically conductive interconnect members.