Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package
AssigneeSekisui Kasei Co., Ltd.
InventorKoichiro Okamoto
Life of this patent
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Abstract
There are provided a resin composition for semiconductor sealing, an underfill, a mold resin, and a semiconductor package that exhibit an excellent low dielectric property by a non-conventional new approach. A resin composition for semiconductor sealing according to an embodiment of the present invention is a resin composition for semiconductor sealing containing a thermosetting resin, a curing agent, an inorganic filler, and hollow resin particles, in which the hollow resin particles are contained in the resin composition for semiconductor sealing in an amount of 1% by weight to 50% by weight.
Claims7
A resin composition for semiconductor sealing comprising a thermosetting resin, an inorganic filler, and hollow resin particles,
- wherein the hollow resin particles are at least one selected from the group consisting of hollow resin particles (1) and (2),
- wherein the hollow resin particles (1) are hollow resin particles having a shell portion and a hollow portion having one hollow region surrounded by the shell portion, and the shell portion contains an aromatic polymer (P1) obtained by polymerizing a monomer composition containing an aromatic crosslinking monomer (a), an aromatic monofunctional monomer (b), and a (meth)acrylic acid ester-based monomer (c) represented by formula (1);
- where R1 represents H or CH3, R2 represents H, an alkyl group or a phenyl group, R3—O represents an oxyalkylene group having 2 to 18 carbon atoms, and m is an average addition molar number of the oxyalkylene group and represents an integer of 1 to 100,
- wherein the hollow resin particles (2) are hollow resin particles having a hole portion whose structure is a porous structure inside the particle, and the hollow resin particles (2) contain a polymer (P) containing a structural unit (I) derived from a vinyl-based monomer and a structural unit (II) derived from a phosphoric acid ester-based monomer;
- and
- wherein the hollow resin particles are contained in the resin composition for semiconductor sealing in an amount of 1% by weight to 50% by weight.
Dependencies are inferred from the claim text.