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US 12,588,546 B2Granted
Semiconductor device comprising a semiconductor die and a carrier both covered by a parylene coating
AssigneeInfineon Technologies AG
InventorsRichard Knipper, Thorsten Meyer
Life of this patent
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Abstract
A semiconductor device includes a carrier comprising a recess, a semiconductor die disposed in the recess, and a parylene coating covering at least portions of the surfaces of the semiconductor die and the carrier.
Claims13
A semiconductor device, comprising
- a carrier comprising a recess;
- a semiconductor die disposed in the recess;
- and
- a parylene coating covering at least portions of the surfaces of the semiconductor die and/or the carrier, wherein either:
- the parylene coating covers all portions of the surfaces of the semiconductor die and the carrier;
- or
- the parylene coating covers all portions of the surfaces of the semiconductor die and the carrier besides a connection surface between the semiconductor die and carrier.
4 more elements
A method for fabricating a semiconductor device, the method comprising
- providing a carrier comprising a recess;
- providing a semiconductor die and disposing the semiconductor die in the recess;
- and
- applying a parylene coating onto the carrier and the semiconductor die,
- wherein either:
- the parylene coating covers all portions of the surfaces of the semiconductor die and the carrier;
- or
- the parylene coating covers all portions of the surfaces of the semiconductor die and the carrier besides a connection surface between the semiconductor die and carrier.
5 more elements
Dependencies are inferred from the claim text.