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US 12,588,545 B2Granted
Electronic chip with contacts
AssigneeSTMicroelectronics (Tours) SAS
InventorsOlivier Ory, Michael De Cruz
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to at least one embodiment of an electronic chip that includes an integrated circuit formed in and on a semiconductor substrate. The flanks of the substrate being coated with a second protective resin. The electronic chip further includes at least one metal contact arranged on a first face of the semiconductor substrate and extending laterally beyond the flanks of the second protective resin. Said at least one metal contact may have a flat connection face extending continuously in part under the semiconductor substrate and extending laterally beyond the flanks of the second protective resin.
Claims20
A device, comprising:
- a first side and a second side opposite to the first side;
- a first resin at the first side, the first resin including a first flank;
- a second resin at the second side, the second resin is different from the first resin, and the second resin includes a second flank coplanar with the first flank;
- a substrate in the first resin and encased between the first resin and the second resin, the substrate including an integrated circuit;
- an interconnection stack on the substrate, the interconnection stack partially covered by the second resin;
- a metal contact at the second side, the metal contact includes a bracket portion that protrudes from the first flank of the first resin, the metal contact includes:
- an encased portion in the second resin, the encased portion having a first end surface covered by second resin;
- and
- a bracket portion that extends outward from the flank of the first resin;
- and
- a reconnection stud extending from the encased portion to the interconnection stack, the reconnection stud coupling the interconnection stack to the metal contact, and the reconnection stud including a third flank coplanar with the first flank and the second flank, and a second end surface opposite to the third flank and coplanar with the first end surface.
8 more elements
A device, comprising:
- a first side and a second side opposite to the first side;
- a first resin layer that is at the first side, the first resin layer includes a first face and a first flank transverse to the first face;
- a second resin layer at the second side, the second resin layer includes a second flank transverse to the first face, and the second flank is coplanar with the first flank;
- a metal contact at the first side, the metal contact includes:
- a second face flush with the first face of the first resin layer;
- a third face opposite to the second face;
- and
- a bracket portion that protrudes from the flank;
- a reconnection stud that is on the third face of the metal contact, the reconnection stud includes a third flank that is coplanar with the first flank and the second flank, and the reconnection stud includes an end surface that is exposed from the first resin layer and the second resin layer;
- an interconnection stack that is on the reconnection stud;
- and
- a substrate including an integrated circuit that is within the second resin layer and is on the interconnection stack.
9 more elements
A device, comprising:
- a first side and a second side opposite to the first side;
- a first protective resin at the first side, the first protective resin including one or more first flanks;
- a second protective resin at the second side, the second protective resin includes one or more second flanks, and the one or more second flanks are coplanar with the one or more first flanks;
- a substrate that has a first surface, a second surface opposite to the first surface, and one or more third flanks that extend from the first surface to the second surface, the substrate includes an integrated circuit, and the one or more third flanks and the second surface are covered by the first protective resin;
- an interconnection stack on the first surface of the substrate, and the interconnection stack is at least partially covered by the second protective resin;
- a reconnection stud on the interconnection stack, the reconnection stud includes a fourth flank that is coplanar with a corresponding first flank of the one or more first flanks of the first protective resin and a corresponding second flank of the one or more second flanks of the second protective resin, and the fourth flank is exposed from the first protective resin and the second protective resin;
- and
- a metal contact coupled to the reconnection stud, the metal contact includes a bracket portion that protrudes outward and beyond a corresponding first flank of the one or more first flanks and a portion of the metal contact is within the second protective resin.
5 more elements
Dependencies are inferred from the claim text.