Multi-tool and multi-directional package singulation

A method for manufacturing a semiconductor package, comprising:

• coupling first and second semiconductor dies to a metal frame;
• covering the first and second semiconductor dies and the metal frame with a mold compound;
• coupling first and second passive components to the first and second semiconductor dies, the first and second passive components on an external surface of the mold compound;
• sawing through a portion of the metal frame from a first direction to form a first vertical surface of the metal frame, the first vertical surface having a first roughness due to the sawing;
• and
• laser cutting through the mold compound and a remainder of the metal frame from a second direction opposing the first direction to form a second vertical surface on the metal frame and a third vertical surface on the mold compound, the second vertical surface having a second roughness due to the laser cutting and the third vertical surface having a third roughness due to the laser cutting, wherein prior to the sawing and the laser cutting, applying a tape to the first and second passive components, the tape comprising a material composition including polyolefin and acrylic.