Semiconductor structure having dummy conductive member and manufacturing method thereof

A semiconductor structure, comprising:

• a first wafer including a first substrate, a first bonding layer over the first substrate, a first via extending through the first bonding layer, and a plurality of first dummy conductive members surrounding the first via and horizontally extending along a top surface of the first bonding layer;
• and
• a second wafer including a second bonding layer over the first bonding layer, a second via extending through the second bonding layer, and a plurality of second dummy conductive members surrounding the second via and horizontally extending along a top surface of the second bonding layer,
• wherein the first bonding layer is bonded to the second bonding layer, and the plurality of first dummy conductive members are correspondingly bonded to the plurality of second dummy conductive members.

A method of manufacturing a semiconductor structure, comprising:

• forming a first wafer, including:
• providing a first substrate, a first dielectric layer over the first substrate, and a first bonding layer over the first dielectric layer;
• removing portions of the first bonding layer to form a first opening extending through the first bonding layer and a second opening extending partially through the first bonding layer;
• and
• disposing first conductive materials into the first opening and the second opening to form a first via and a first dummy conductive member respectively;
• forming a second wafer, including:
• providing a second substrate, a second dielectric layer over the second substrate, and a second bonding layer over the second dielectric layer;
• removing portions of the second bonding layer to form a third opening extending through the second bonding layer and a fourth opening extending partially through the second bonding layer;
• and
• disposing second conductive materials into the third opening and the fourth opening to form a second via and a second dummy conductive member respectively;
• and
• bonding the second wafer to the first wafer, including:
• bonding the first bonding layer to the second bonding layer;
• bonding the first via to the second via;
• and
• bonding the first dummy conductive member to the second dummy conductive member.