Semiconductor device having dismantlable structure and method therefor

A method comprising:

• forming a packaged semiconductor die, the packaged semiconductor die comprising:
• mounting the semiconductor die onto a package substrate in a flip chip orientation, a bond pad of the semiconductor die interconnected with a conductive trace of the package substrate;
• attaching an interposer substrate over a backside of the semiconductor die, the interposer substrate having a plurality of conductive pads exposed at a top surface, the plurality of conductive pads interconnected with the package substrate by way of a plurality of conductive substrate connectors;
• and
• encapsulating with an encapsulant the semiconductor die and remaining gap region between the package substrate and the interposer substrate;
• and
• attaching a dismantlable structure onto the top surface of the interposer substrate, a first region of the dismantlable structure covering the plurality of conductive pads.

A method comprising:

• forming a packaged semiconductor die, the packaged semiconductor die comprising:
• mounting the semiconductor die onto a package substrate in a flip chip orientation, a bond pad of the semiconductor die interconnected with a conductive trace of the package substrate;
• attaching an interposer substrate over a backside of the semiconductor die, the interposer substrate having a plurality of conductive pads exposed at a top surface, the plurality of conductive pads interconnected with the package substrate by way of a plurality of conductive substrate connectors;
• and
• encapsulating with an encapsulant the semiconductor die and remaining gap region between the package substrate and the interposer substrate;
• dispensing an adhesive onto the top surface of the interposer substrate;
• and
• attaching a dismantlable structure onto the interposer substrate by way of the adhesive, the dismantlable structure including a first region covering the plurality of conductive pads and a second region joined to the first region by way of one or more connecting segments of the dismantlable structure.