Semiconductor device

A semiconductor device comprising:

• a wiring substrate having an upper surface, a lower surface opposite the upper surface, and a plurality of wiring layers provided between the upper surface and the lower surface;
• and
• a semiconductor chip having a first surface, a plurality of bump electrodes formed on the first surface, and a second surface opposite the first surface, the semiconductor chip being mounted on the upper surface of the wiring substrate via the plurality of bump electrodes,
• wherein the semiconductor chip includes a first analog circuit,
• wherein the plurality of wiring layers of the wiring substrate includes:
• a first wiring layer which is nearest to the lower surface among the plurality of wiring layers, and which is provided with a plurality of land patterns;
• and
• a second wiring layer which is next nearest to the lower surface after the first wiring layer,
• wherein a first power supply potential pattern capable of supplying a first power supply potential to the first analog circuit and a first reference potential pattern capable of supplying a first reference potential to the first analog circuit are electrically connected with the first analog circuit,
• wherein one of the first power supply potential pattern and the first reference potential pattern is provided in the first wiring layer,
• wherein another of the first power supply potential pattern and the first reference potential pattern is provided in the second wiring layer, and
• wherein the first power supply potential pattern and the first reference potential pattern extend in a same direction as each other while mutually overlapping with each other.