Quantum device
AssigneeNEC Corporation
InventorsKatsumi Kikuchi, Akira Miyata, Suguru Watanabe, Takanori Nishi, Hideyuki Satou, Kenji Nanba, Ayami Yamaguchi
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AssigneeNEC Corporation
InventorsKatsumi Kikuchi, Akira Miyata, Suguru Watanabe, Takanori Nishi, Hideyuki Satou, Kenji Nanba, Ayami Yamaguchi
Estimating the term…
A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.
A quantum device system comprising:
Dependencies are inferred from the claim text.