Dielectric interposer with electrical-connection cut-in

A semiconductor package, comprising:

• a metal layer;
• a solder mask surrounding a plurality of electrical connections;
• a dielectric interposer disposed between the metal layer and the solder mask, wherein the dielectric interposer includes a first outer surface coupled to the metal layer and an opposing second outer surface spaced apart from the first outer surface in a direction and coupled to the solder mask;
• a first electrical-connection cut-in provided in the second outer surface that extends, in the direction, toward the first outer surface;
• and
• one or more first electrical connections isolated from the first outer surface and disposed within the first electrical-connection cut-in.

A memory device, comprising:

• a base layer;
• a dielectric interposer coupled to the base layer and including a first outer surface facing the base layer and an opposing second outer surface facing away from the base layer and spaced apart from the first outer surface in a direction;
• a first electrical-connection cut-in in the second outer surface that extends, in the direction, toward the first outer surface;
• one or more first electrical connections isolated from the first outer surface and disposed within the first electrical-connection cut-in such that at least a portion of the one or more first electrical connections does not extend, in the direction, beyond the second outer surface;
• and
• a memory die electrically coupled to the one or more first electrical connections.

A semiconductor device, comprising:

• a dielectric interposer having a first outer surface and an opposing second outer surface;
• an electrical-connection cut-in in the second outer surface that extends toward the first outer surface;
• and
• one or more first electrical connections isolated from the first outer surface and within the electrical-connection cut-in.

A semiconductor package, comprising:

• a dielectric interposer, disposed between a metal layer and a solder mask, having a first outer surface and an opposing second outer surface;
• a first electrical-connection cut-in provided in the second outer surface that extends, in a direction, toward the first outer surface;
• and
• one or more first electrical connections isolated from the first outer surface and disposed within the first electrical-connection cut-in.