Semiconductor package structure

A semiconductor package structure, comprising:

• a first package structure, comprising:
• a first redistribution layer;
• a first semiconductor die disposed over the first redistribution layer and electrically coupled to the first redistribution layer through a plurality of first conductive connectors;
• a second semiconductor die disposed over the first semiconductor die;
• an adhesive layer connecting the first semiconductor die and the second semiconductor die;
• and
• a second redistribution layer disposed over the second semiconductor die and electrically coupled to the second semiconductor die through a plurality of second conductive connectors;
• a second package structure disposed over the first package structure;
• and
• a third semiconductor die disposed between the second package structure and the first package structure,
• wherein the second semiconductor die is disposed between the first semiconductor die and the third semiconductor die.

A semiconductor package structure, comprising:

• a first redistribution layer;
• a second redistribution layer disposed over the first redistribution layer;
• a first semiconductor die disposed between the first redistribution layer and the second redistribution layer and electrically coupled to the first redistribution layer;
• a second semiconductor die and a third semiconductor die disposed side-by-side over the first semiconductor die and electrically coupled to the second redistribution layer;
• an adhesive layer connecting the first semiconductor die and the second semiconductor die and connecting the first semiconductor die and the third semiconductor die;
• a molding material surrounding the first semiconductor die, the adhesive layer, the second semiconductor die, and the third semiconductor die;
• a package structure disposed over and electrically coupled to the second redistribution layer;
• and
• a fourth semiconductor die disposed between the package structure and the second redistribution layer.