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US 12,588,521 B2Granted
Metal nitride core-shell particle die-attach material
AssigneeWolfspeed, Inc.
InventorsAfshin Dadvand, Devarajan Balaraman
Life of this patent
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Abstract
Die attach materials are provided. In one example, the die-attach material includes a plurality of core-shell particles. Each core-shell particle includes a core and a shell on the core. The core includes a conducting material. The shell includes a metal nitride.
Claims19
A die-attach material, comprising:
- a plurality of core-shell particles, each core-shell particle comprising a core and a shell on the core;
- wherein the core comprises a conducting material;
- and
- wherein the shell comprises a copper nitride.
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A die-attach material, comprising:
- a plurality of core-shell particles, each core-shell particle comprising a core and a shell on the core;
- wherein the core comprises copper and the shell comprises copper nitride;
- and
- wherein the die-attach material is an ink or a paste.
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A device, comprising:
- a semiconductor die comprising a wide band gap semiconductor material;
- a substrate;
- and
- a die-attach material between the semiconductor die and the substrate, the die-attach material comprising a plurality of bonded conductive particles and a metal nitride.
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Dependencies are inferred from the claim text.