Electronic device and method for manufacturing electronic device

An electronic device, comprising:

• an electronic component having an element front surface and an element back surface separated from each other in a thickness direction;
• a mounting portion which has a mounting surface opposed to the element back surface and on which the electronic component is mounted;
• and
• a bonding material to bond the electronic component to the mounting portion,
• wherein the bonding material includes a base portion held between the electronic component and the mounting portion in the thickness direction, and a fillet portion connected to the base portion and formed outside the electronic component when seen in the thickness direction,
• wherein the electronic component includes a first element lateral surface and a second element lateral surface each of which is continuous to the element front surface and the element back surface, and a ridge which is an intersection of the first element lateral surface and the second element lateral surface and extends in the thickness direction,
• wherein the fillet portion includes a ridge cover portion which at least covers a part of the ridge, and a first cover portion to cover at least a part of the first element lateral surface,
• wherein the first cover portion is continuous to the ridge cover portion, and
• wherein, as to the first cover portion, a dimension in the thickness direction of a central portion as viewed in a second direction orthogonal to the second element lateral surface is smaller than a dimension in the thickness direction of a peripheral end continuous to the ridge cover portion, and the first cover portion has a profile such that the dimension in the thickness direction gradually changes starting from the central portion up to the peripheral end.