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US 12,588,517 B2Granted
Semiconductor device with self-aligned waveguide and method therefor
AssigneeNXP USA, Inc.
InventorsMichael B. Vincent, Scott M. Hayes, Antonius Hendrikus Jozef Kamphuis
Life of this patent
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Abstract
A method of forming a self-aligned waveguide is provided. The method includes forming a first alignment feature on a packaged semiconductor device and a second alignment feature on a waveguide structure. A solder material is applied to the first alignment feature or the second alignment feature. The waveguide structure is placed onto the packaged semiconductor device such that the second alignment feature overlaps the first alignment feature. The solder material is reflowed to cause the waveguide structure to align with the packaged semiconductor device.
Claims20
An apparatus comprising:
- a packaged semiconductor device including:
- a package substrate having a top side and a bottom side,
- a semiconductor die coupled to the package substrate,
- a signal launcher exposed at the top side of the package substrate and interconnected with the semiconductor die through conductive features of the package substrate, wherein the signal launcher is configured for propagation of radio frequency signals, and
- a first alignment feature exposed at the top side of the package substrate adjacent to the signal launcher;
- and
- a waveguide structure having a top side and a bottom side, wherein the bottom side of the waveguide structure is coupled to the top side of the package substrate, the waveguide structure including:
- a waveguide extending from a waveguide bottom at the bottom side of the waveguide structure to a waveguide top at the top side of the waveguide structure, wherein the waveguide bottom is aligned with the signal launcher, and
- a second alignment feature formed at the bottom side of the waveguide structure adjacent to the waveguide bottom, the second alignment feature aligned with and connected to the first alignment feature by way of a solder connection.
6 more elements
An apparatus comprising:
- a packaged semiconductor device including:
- a package substrate having a top side and a bottom side,
- a semiconductor die coupled to the package substrate,
- a signal launcher exposed at the top side of the package substrate and interconnected with the semiconductor die through conductive features of the package substrate, wherein the signal launcher is configured for propagation of radio frequency signals, and
- a first alignment feature exposed at the top side of the package substrate adjacent to the signal launcher, the first alignment feature including one or more first metal pads having a solderable surface;
- a waveguide structure having a top side and a bottom side, wherein the bottom side of the waveguide structure is coupled to the top side of the package substrate, the waveguide structure including:
- a waveguide extending from a waveguide bottom at the bottom side of the waveguide structure to a waveguide top at the top side of the waveguide structure, wherein the waveguide bottom is aligned with the signal launcher, and
- a second alignment feature formed at the bottom side of the waveguide structure adjacent to the waveguide bottom;
- and
- a solder material configured to form a solder connection between the first alignment feature and the second alignment feature, the second alignment feature aligned with the first alignment feature by way of the solder connection.
7 more elements
An apparatus comprising:
- a packaged semiconductor device including:
- a package substrate having a top side and a bottom side,
- a semiconductor die coupled to the package substrate,
- a signal launcher exposed at the top side of the package substrate and interconnected with the semiconductor die through conductive features of the package substrate, wherein the signal launcher is configured for propagation of radio frequency signals, and
- a first alignment feature exposed at the top side of the package substrate adjacent to the signal launcher, the first alignment feature including a first metal pad having a solderable surface exposed at the top side of the package substrate;
- and
- a waveguide structure having a top side and a bottom side, wherein the bottom side of the waveguide structure is coupled to the top side of the package substrate, the waveguide structure including:
- a waveguide extending from a waveguide bottom at the bottom side of the waveguide structure to a waveguide top at the top side of the waveguide structure, wherein the waveguide bottom is aligned with the signal launcher, and
- a second alignment feature formed at the bottom side of the waveguide structure adjacent to the waveguide bottom, the second alignment feature including a second metal pad having a solderable surface exposed at the bottom side of the waveguide structure, and the second alignment feature aligned with and connected to the first alignment feature by way of a solder connection.
6 more elements
Dependencies are inferred from the claim text.