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US 12,588,511 B2Granted
Shielding assembly for semiconductor packages
AssigneeIntel Corporation
InventorsPoh Boon Khoo, Jiun Hann Sir, Min Suet Lim, Seok Ling Lim, Yew San Lim
Life of this patent
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Abstract
A semiconductor package including a package substrate including a bottom surface; a first plurality of solder balls connected to the bottom surface of the package substrate; a second plurality of solder balls connected to a motherboard; and a shielding assembly interposed between the first and the second plurality of solder balls and configured to shield each solder ball of the first and second plurality of solder balls from electromagnetic interference.
Claims12
A semiconductor package comprising:
- a package substrate comprising a bottom surface;
- a first plurality of solder balls connected to the bottom surface of the package substrate;
- a second plurality of solder balls connected to a motherboard;
- and
- a shielding assembly interposed between the first and the second plurality of solder balls, wherein the first plurality of solder balls is disposed on a top surface of the shielding assembly and the second plurality of solder balls is disposed on a bottom surface of the shielding assembly, wherein each of the solder balls of the first plurality of solder balls is oppositely aligned with a corresponding solder ball of the second plurality of solder balls to form a coupled pair of solder balls;
- wherein the shielding assembly comprises a plurality of protrusions extending from a top surface and from a bottom surface of the metal layer into a space between each solder ball of the first and second plurality of solder balls;
- wherein each protrusion of the plurality of protrusions is covered with an insulating layer configured to insulate each of the solder balls of the first and the second plurality of solder balls.
4 more elements
A computing device, comprising:
- a motherboard;
- semiconductor package comprising a package substrate comprising a bottom surface;
- a first plurality of solder balls connected to the bottom surface of the package substrate;
- a second plurality of solder balls connected to the motherboard;
- and
- a shielding assembly interposed between the first and the second plurality of solder balls, wherein the first plurality of solder balls is disposed on a top surface of the shielding assembly and the second plurality of solder balls is disposed on a bottom surface of the shielding assembly, wherein each of the solder balls of the first plurality of solder balls is oppositely aligned with a corresponding solder ball of the second plurality of solder balls to form a coupled pair of solder balls;
- wherein the shielding assembly comprises a plurality of protrusions extending from a top surface and from a bottom surface of the metal layer into a space between each solder ball of the first and second plurality of solder balls;
- wherein each protrusion of the plurality of protrusions is covered with an insulating layer configured to insulate each of the solder balls of the first and the second plurality of solder balls.
5 more elements
Dependencies are inferred from the claim text.