Weight optimized stiffener and sealing structure for direct liquid cooled modules
AssigneeGoogle Inc.
InventorsMadhusudan K. Iyengar, Connor Burgess, Padam Jain, Emad Samadiani, Yuan Li
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Abstract
A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.
Claims10
A method of assembling a semiconductor device for providing warpage control to a direct liquid cooled module, comprising:
- providing a weight optimized stiffener having a top surface, a bottom surface, an outer periphery and an inner periphery forming a central aperture through the top and bottom surfaces;
- providing a substrate having a top surface including circuitry on at least a first region of the top surface;
- coupling the top surface of the substrate to the bottom surface of the stiffener such that the first region of the top surface of the substrate is accessible through the aperture of the stiffener;
- coupling a top plate to the top surface of the stiffener;
- and
- providing an O-ring as a seal directly between the stiffener and the top plate.
Dependencies are inferred from the claim text.