Terminal interposers with mold flow channels, circuit modules including such terminal interposers, and associated methods

A terminal interposer comprising:

• a dielectric body with a top surface, a bottom surface, first and second parallel side surfaces, a first mold flow channel extending between the first and second parallel side surfaces, and a second mold flow channel that is open along and extends into the top surface of the dielectric body between the first and second conductive terminals;
• a first conductive terminal embedded within the dielectric body and extending between the top and bottom surfaces of the dielectric body at a first side of the first mold flow channel;
• and
• a second conductive terminal embedded within the dielectric body and extending between the top and bottom surfaces of the dielectric body at a second side of the first mold flow channel.

A circuit module comprising:

• a module substrate with a mounting surface and a plurality of conductive pads at the mounting surface;
• a first terminal interposer coupled to the mounting surface of the module substrate, wherein the first terminal interposer includes
• a dielectric body with top, bottom, opposed first and second side surfaces that are parallel with a first side of module substrate, opposed third and fourth side surfaces that are perpendicular to the first side of module substrate, and one or more mold flow channels extending from at least one of the side surfaces into the dielectric body, wherein the one or more mold flow channels include a first mold flow channel extending between the first and second side surfaces of the dielectric body, and a second mold flow channel extending between the third and fourth side surfaces of the dielectric body, and
• a first conductive terminal embedded within the dielectric body and extending between the top and bottom surfaces of the dielectric body, wherein a proximal end of the first conductive terminal is coupled to a first conductive pad of the plurality of conductive pads;
• and
• encapsulant material covering at least a portion of the mounting surface of the module substrate and extending into the one or more mold flow channels.