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US 12,588,508 B2Granted
Package comprising a lid structure with a compartment
AssigneeQUALCOMM Incorporated
InventorsYoumin Yu, Wei Wu, Guoping Xu, Nader Nikfar
Life of this patent
Estimating the term…
Abstract
A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the inner top surface of the first compartment of the lid structure. The substrate includes at least one dielectric layer and a plurality of interconnects.
Claims17
A package comprising:
- a substrate comprising:
- at least one dielectric layer;
- and
- a plurality of interconnects;
- a first integrated device coupled to a first surface of the substrate;
- a lid structure coupled to the substrate, wherein the lid structure includes a first compartment comprising a side surface and an inner top surface,
- wherein the first compartment vertically overlaps with the first integrated device, and
- wherein the side surface of the first compartment laterally surrounds a portion of the first integrated device;
- and
- a thermal interface material coupled to and touching (i) a back side of the first integrated device, (ii) a side surface of the first integrated device, and (iii) the side surface and the inner top surface of the first compartment of the lid structure.
7 more elements
A device comprising:
- a package comprising:
- a substrate comprising:
- at least one dielectric layer;
- and
- a plurality of interconnects;
- a first integrated device coupled to a first surface of the substrate;
- a lid structure coupled to the substrate, wherein the lid structure includes a first compartment comprising a side surface and an inner top surface,
- wherein the first compartment vertically overlaps with the first integrated device, and
- wherein the side surface of the first compartment laterally surrounds a portion of the first integrated device;
- and
- a thermal interface material coupled to and touching (i) a back side of the first integrated device, (ii) a side surface of the first integrated device and (iii) the side surface and the inner top surface of the first compartment of the lid structure.
8 more elements
A method for fabricating a package, comprising:
- providing a substrate comprising:
- at least one dielectric layer;
- and
- a plurality of interconnects;
- coupling a first integrated device to a first surface of the substrate;
- coupling a lid structure to the substrate, wherein the lid structure includes a first compartment comprising a side surface and an inner top surface,
- wherein the first compartment vertically overlaps with the first integrated device, and
- wherein the side surface of the first compartment laterally surrounds a portion of the first integrated device;
- and
- wherein coupling the lid structure comprises coupling the lid structure to the first integrated device through a thermal interface material, and
- wherein the thermal interface material is coupled to and touching (i) a back side of the first integrated device, (ii) a side surface of the first integrated device and (iii) the side surface and the inner top surface of the first compartment of the lid structure.
8 more elements
Dependencies are inferred from the claim text.