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US 12,588,503 B2Granted
Electronic device
AssigneeMurata Manufacturing Co., Ltd.
InventorTakashi Iwamoto
Life of this patent
Estimating the term…
Abstract
An electronic device includes a substrate, a support body, and a conductive film. The substrate is a piezoelectric substrate or a compound semiconductor substrate including a first main surface with functional elements. The support body is provided at a second main surface of the substrate opposite to the first main surface and has a higher thermal conductivity than the substrate. The conductive film is located in a through hole extending through the support body and has a higher thermal conductivity than the support body.
Claims12
An electronic device comprising:
- a functional element substrate including a first main surface provided with a functional element that is a piezoelectric substrate or a compound semiconductor substrate;
- a support body that is provided at a second main surface of the functional element substrate opposite to the first main surface, the support body having a higher thermal conductivity than the functional element substrate;
- and
- a through body located in a through hole extending through the support body and having a higher thermal conductivity than the support body;
- wherein
- the through body includes at least a portion that overlaps, in the functional element substrate in plan view from the support body, a region in which the functional element is provided;
- and
- the through body is exposed from each of a first surface of the support body that faces the second main surface of the functional element substrate and a second surface of the support body that is opposite to the first surface of the support body.
5 more elements
Dependencies are inferred from the claim text.