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US 12,588,500 B2Granted
Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsKyungdon Mun, Donghwa Kwak, Inho Roh
Life of this patent
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Abstract
A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate and that includes a first semiconductor substrate that includes through electrodes, and a second semiconductor chip disposed on the first semiconductor chip and that includes a second semiconductor substrate that includes an active surface and an inactive surface. The second semiconductor chip further includes a plurality of isolated heat dissipation fins that extend in a vertical direction from the inactive surface.
Claims9
A semiconductor package, comprising:
- a package substrate;
- a first semiconductor chip mourned on the package substrate, wherein the first semiconductor chip includes a first semiconductor substrate that includes through electrodes;
- and
- a second semiconductor chip disposed on the first semiconductor chip, wherein the second semiconductor chip includes a second semiconductor substrate that includes an active surface and an inactive surface, and the second semiconductor substrate includes a plurality of isolated heat dissipation fins that extend from the inactive surface in a vertical direction,
- wherein the second semiconductor chip comprises an active area in which active transistors are arranged and a dummy area in which dummy transistors are arranged, and
- wherein a first distribution density of the plurality of heat dissipation fins in the active area is less than a second distribution density of the plurality of heat dissipation fins in the dummy area.
3 more elements
Dependencies are inferred from the claim text.