Connecting semicondcutor device assembly components using interconnect dies with spacer component coupled to a portion of an interconnect die

A semiconductor assembly comprising:

• a die having a front surface and a back surface opposite to and parallel to the front surface;
• an interconnect die, where a first portion of a front surface of the interconnect die is coupled to a portion of the back surface of the die and the interconnect die including a connectivity region having conductive pathways and the connectivity region coupled to one or more through-die vias in the die through the back surface of the die;
• a conductive trace layer comprising a plurality of conductive traces included in a dielectric material, the plurality of conductive traces perpendicular to the conductive connections of a spacer component and coupled to one or more of conductive connections of the spacer component;
• and
• the spacer component is separate from the die and coupled to a second portion of the front surface of the interconnect die,
• the spacer component including one or more conductive connections coupled to one or more of the conductive pathways of the connectivity region of the interconnect die, wherein
• the spacer component has a thickness that is substantially the same as a distance between the front surface of the interconnect die and a topmost surface of the plurality of conductive traces.