Method for forming semiconductor redistribution structures

A method comprising:

• forming a first dielectric layer over a first substrate, the first dielectric layer having a first metallization pattern therein;
• forming a first via in a second dielectric layer over the first dielectric layer, the first via being electrically coupled to the first metallization pattern;
• forming a conductive pad over the first via and the second dielectric layer, the conductive pad being electrically coupled to the first via, wherein the first via and the conductive pad are formed by a single deposition process;
• forming a bond via in a third dielectric layer over the conductive pad and the second dielectric layer, the bond via being electrically coupled to the conductive pad, the bond via overlapping the first via;
• and
• forming a first bond pad in a fourth dielectric layer over the bond via and the third dielectric layer, the first bond pad being electrically coupled to the bond via, the first bond pad overlapping the first via.

A method comprising:

• forming a first interconnect structure over a first substrate, the first interconnect structure comprising dielectric layers and metallization patterns therein, a through substrate via extending through the first interconnect structure and at least partially through the first substrate;
• forming a redistribution via over the first interconnect structure, the redistribution via being electrically coupled to at least one of the metallization patterns of the first interconnect structure, the redistribution via being electrically coupled to the through substrate via;
• forming a redistribution pad over the redistribution via, the redistribution pad being electrically coupled to the redistribution via;
• forming a bond via over the redistribution pad, the bonding via being electrically coupled to the redistribution pad, the bond via overlapping the redistribution via;
• and
• forming a first bond pad over the bonding via, the first bond pad being electrically coupled to the bond via, the first bond pad overlapping the redistribution via.