Via accuracy measurement
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWei-Hsuen Lee, Hung En Hsu, Kuo-Ching Hsu
Life of this patent
Estimating the term…
Abstract
Methods and pad structures to test via accuracy are provided. A method according to the present disclosure includes forming a first pad and a second pad on a device component, wherein the second pad includes a via landing area and a clearance opening, providing a core substrate that includes a cavity, placing the device component in the cavity, forming a build-up film over the device component and the core substrate, forming a first contact via extending through the build-up film to contact the landing area and a second contact via extending through build-up film and the clearance opening, and performing a continuity test to determine whether the second contact via is in contact with the second pad.
Claims20
A method, comprising:
- forming a first pad and a second pad on a device component, wherein the second pad includes a via landing area and a clearance opening;
- providing a core substrate that includes a cavity;
- placing the device component in the cavity;
- forming a build-up film over the device component and the core substrate;
- forming a first contact via extending through the build-up film to contact the landing area and a second contact via extending through build-up film and through the clearance opening to contact the device component;
- and
- performing a continuity test to determine whether the second contact via is in contact with the second pad.
A method, comprising:
- forming a first pad and a second pad on a device component, wherein the first pad includes a first via landing area and a first clearance opening and the second pad includes a second via landing area and a second clearance opening;
- forming a build-up film over the device component;
- forming a first contact via and a second contact via extending through the build-up film to contact the first via landing area and the second via landing area, respectively;
- forming a first test via and a second test via through the first clearance opening and the second clearance opening, respectively, to contact the device component;
- and
- performing a continuity test to determine whether the first test via contacts the first pad and to determine whether the second test via contacts the second pad.
A method, comprising:
- forming a first pad and a second pad on a device component, wherein the second pad includes a via landing area and a clearance opening;
- forming a build-up film over the device component;
- forming a contact via extending through the build-up film to contact the via landing area;
- forming a test via through the clearance opening to contact the device component;
- and
- performing a continuity test to determine whether the test via contacts the second pad.
Dependencies are inferred from the claim text.