Substrate processing method and substrate processing apparatus

A control device that controls a substrate processing apparatus,

• wherein the substrate processing apparatus comprises:
• a chuck configured to hold a substrate;
• a rotation mechanism configured to rotate the chuck;
• a first nozzle configured to supply a processing liquid to a substrate surface of the substrate which is rotating;
• a first flow rate controller configured to control a flow rate of the processing liquid supplied from the first nozzle;
• a first movement mechanism configured to move the first nozzle and shift a supply position of the processing liquid in a radial direction of the substrate surface;
• a second nozzle configured to supply a substitute liquid to the substrate surface of the substrate which is rotating;
• a second flow rate controller configured to control a flow rate of the substitute liquid supplied from the second nozzle;
• and
• a second movement mechanism configured to move the second nozzle and shift a supply position of the substitute liquid in the radial direction of the substrate surface, and
• wherein the control device controls the rotation mechanism, the first movement mechanism, the first flow rate controller, the second movement mechanism, and the second flow rate controller to execute:
• supplying a processing liquid to a center position of a substrate surface of a rotating substrate;
• shifting a supply position of the processing liquid from the center position to a first eccentric position;
• supplying a substitute liquid for substituting the processing liquid to a second eccentric position different from the first eccentric position;
• and
• shifting the supply position of the processing liquid from the first eccentric position in a direction away from the center position, and shifting a supply position of the substitute liquid from the second eccentric position to the center position.