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US 12,588,453 B2Granted
Apparatus for treating substrate and related manufacturing method
AssigneeSemes Co., Ltd.
InventorYoung Jun Son
Life of this patent
Estimating the term…
Abstract
A substrate treating apparatus includes a housing having an inner space; a support positioned in the inner space and configured to support a substrate; a treating container having a treating space therein and surrounding the supported substrate. A cleaning unit may supply a liquid to the substrate supporting on the support and a heating unit may heat a fluid that is supplied to the treating space to decrease a relative humidity of the treating space.
Claims15
A substrate treating apparatus comprising:
- a housing having an inner space;
- a first support disposed in the inner space below a center region of a substrate and configured to contact a bottom surface of the substrate;
- a treating container providing a treating space therein, the treating container being disposed in the inner space and surrounding the substrate supported on the first support;
- a fluid supply unit provided below the substrate between the first support and the treating container to surround the first support and configured to supply a fluid toward the bottom surface of the substrate;
- a first cleaning unit positioned below the substrate between the fluid supply unit and the treating container and configured to supply a liquid to the substrate supported on the first support;
- and
- a heating unit configured to heat the fluid supplied by the fluid supply unit toward the bottom surface of the substrate to adjust a relative humidity of the treating space,
- wherein an upper surface of the fluid supply unit is inclined in a direction toward an edge region of the substrate,
- wherein the first support is further configured to support the center region of the substrate and to rotate the substrate,
- wherein the fluid supply unit includes:
- a body having a groove formed at a top surface and surrounding the first support, and
- a main pipe connected to the groove to supply the fluid, and
- wherein the heating unit includes a resistive beating element inserted into the groove to heat the fluid which passes through the groove.
10 more elements
A substrate treating apparatus comprising:
- a housing having an inner space;
- a first support disposed in the inner space below a center region of a substrate;
- a treating container providing a treating space therein, the treating container being disposed in the inner space and surrounding the substrate supported on the first support;
- a fluid supply unit provided below the substrate to surround the first support and configured to supply a fluid toward a bottom surface of the substrate;
- a first cleaning unit provided below the substrate between the fluid supply unit and the treating container and configured to supply a liquid to the bottom surface of the substrate supported on the first support;
- and
- a heating unit connected to the fluid supply unit and configured to heat the fluid supplied to the bottom surface of the substrate to adjust a relative humidity of the treating space,
- wherein the fluid supply unit includes a main pipe and a bypass pipe for bypassing the fluid past at least a portion of the main pipe,
- wherein the heating unit includes a heater installed at the bypass pipe to heat the fluid that flows through the bypass pipe, and
- wherein an upper surface of the fluid supply unit is inclined in a direction toward an edge region of the substrate
- wherein the first support is configured to support the center region of the substrate and to rotate the substrate,
- wherein the fluid supply unit includes a body having a groove formed at a top surface and surrounding the first support,
- wherein the main pipe is connected to the groove to supply the fluid, and
- wherein the heating unit includes a resistive heating element inserted into the groove to beat the fluid which passes through the groove.
11 more elements
Dependencies are inferred from the claim text.