Display device and method for manufacturing the same

A display device comprising:

• a substrate;
• at least one thin-film transistor disposed on the substrate;
• a planarization layer disposed on the thin-film transistor;
• a first metal layer disposed on the planarization layer and connected to the thin-film transistor;
• a first electrode disposed on the first metal layer;
• partitioning walls disposed on the planarization layer and spaced apart from the first electrode, wherein each of the partitioning walls includes a second metal layer and a first conductive layer,
• a pixel defining layer disposed on the first electrode and the partitioning walls;
• an organic layer disposed on the first electrode and the pixel defining layer;
• and
• a second electrode disposed on the organic layer,
• wherein the planarization layer has a groove defined therein, wherein the groove is disposed between the partitioning walls adjacent to each other,
• wherein the groove has an undercut portion beneath the second metal layer of each of the partitioning walls.

A display device comprising:

• a substrate;
• at least one thin-film transistor disposed on the substrate;
• a planarization layer disposed on the thin-film transistor;
• a first conductive pattern and a second conductive pattern disposed on the planarization layer,
• a protective layer disposed on the first conductive pattern and the second conductive pattern;
• a first metal layer disposed on the protective layer and connected to the thin-film transistor via the first conductive pattern;
• a first electrode disposed on the first metal layer;
• partitioning walls disposed on the protective layer, wherein each of the partitioning walls includes a second metal layer and a first conductive layer;
• a pixel defining layer disposed on the first electrode and the partitioning walls;
• an organic layer disposed on the first electrode and the pixel defining layer;
• and
• a second electrode disposed on the organic layer,
• wherein the protective layer has a groove defined therein, wherein the groove is disposed between the partitioning walls adjacent to each other,
• wherein the groove has an undercut portion beneath the second metal layer of each of the partitioning walls,
• wherein the groove vertically overlaps the second conductive pattern.

An electronic device comprising:

• a substrate;
• at least one thin-film transistor disposed on the substrate;
• a planarization layer disposed on the thin-film transistor;
• a first metal layer disposed on the planarization layer and connected to the thin-film transistor;
• a first electrode disposed on the first metal layer;
• partitioning walls disposed on the planarization layer and spaced apart from the first electrode, wherein each of the partitioning walls includes a second metal layer and a first conductive layer;
• a pixel defining layer disposed on the first electrode and the partitioning walls;
• an organic layer disposed on the first electrode and the pixel defining layer;
• and
• a second electrode disposed on the organic layer,
• wherein the second metal layer is disposed under the first conductive layer and has an undercut beneath the first conductive layer,
• wherein the organic layer is discontinuous between the partitioning walls, and
• wherein the partition walls include two partition walls disposed between two adjacent first electrodes, and the two partition walls respectively have undercuts on sides facing each other.