Electronic device and method for manufacturing electronic device

An electronic device, comprising:

• a first insulating layer disposed adjacent to a lower layer wiring, the first insulating layer including a through hole;
• a transparent interlayer connection wiring connected to the lower layer wiring in the through hole,
• wherein the transparent interlayer connection wiring has a shape that extends to a surface side of the first insulating layer;
• a transparent upper layer wiring stacked on and connected to the transparent interlayer connection wiring that extends to the surface side of the first insulating layer,
• wherein the transparent upper layer wiring is connected to the transparent interlayer connection wiring;
• and
• a second insulating layer adjacent to the first insulating layer and adjacent to a side surface of the transparent interlayer connection wiring and a side surface of the transparent upper layer wiring,
• wherein the second insulating layer has a refractive index different from a refractive index of the first insulating layer.