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US 12,588,338 B2Granted
Micro display device and method for fabricating the same
AssigneeUnited Microelectronics Corp.
InventorsChuan-Lan Lin, Yu-Ping Wang, Chien-Ting Lin, Chun-Ting Yeh
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Abstract
A method for fabricating a micro display device includes the steps of providing a wafer comprising a first area, a second area, and a third area, forming first bonding pads on the first area, forming second bonding pads on the second area, and forming third bonding pads on the third area. Preferably, the first bonding pads and the second bonding pads are made of different materials and the first bonding pads and the third bonding pads are made of different materials.
Claims13
A method for fabricating a micro display device, comprising:
- providing a wafer comprising a first area, a second area, and a third area;
- forming first bonding pads on the first area;
- forming second bonding pads on the second area, wherein the first bonding pads and the second bonding pads comprise different materials;
- forming a chip on the second bonding pads;
- and
- forming a micro display on the third area after forming the chip.
3 more elements
A micro display device, comprising:
- a wafer comprising a first area, a second area, and a third area;
- first bonding pads on the first area;
- second bonding pads on the second area, wherein the first bonding pads and the second bonding pads comprise different materials;
- and
- third bonding pads on the third area, wherein the first bonding pads and the third bonding pads comprise different materials.
2 more elements
Dependencies are inferred from the claim text.