Package structure and forming method thereof

A package structure having a light-emitting region and a non-light-emitting region adjacent to the light-emitting region, comprising:

• a substrate;
• a first light-emitting unit disposed on the substrate;
• a first planarization layer disposed on the first light-emitting unit;
• a second light-emitting unit and a third light-emitting unit disposed on the first planarization layer and laterally separated from each other;
• and
• a second planarization layer disposed on the second light-emitting unit and the third light-emitting unit, wherein each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit comprises:
• a transparent adhesive layer disposed in the light-emitting region;
• an LED chip disposed on the transparent adhesive layer;
• and
• a first redistribution layer and a second redistribution layer formed on the LED chip, wherein the first redistribution layer and the second redistribution layer extend from the light-emitting region to the non-light-emitting region;
• wherein, in a top view, the package structure has a rectangle shape with a first side, a second side, a third side, and a fourth side different from each other;
• wherein the second redistribution layer of the first light-emitting unit extends toward the first side, the second redistribution layer of the second light-emitting unit extends toward the second side, and the second redistribution layer of the third light-emitting unit extends toward the third side.

A package structure having a light-emitting region and a non-light-emitting region adjacent to the light-emitting region, comprising:

• a substrate;
• a first light-emitting unit disposed on the substrate;
• a first planarization layer disposed on the first light-emitting unit;
• and
• a second light-emitting unit, a third light-emitting unit, and a second planarization layer disposed between the first light-emitting unit and the substrate, wherein the second light-emitting unit and the third light-emitting unit are laterally separated from each other;
• and the second planarization layer covers the second light-emitting unit and the third light-emitting unit;
• wherein each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit comprises:
• a transparent adhesive layer disposed in the light-emitting region;
• an LED chip disposed on the transparent adhesive layer;
• and
• a first redistribution layer and a second redistribution layer formed on the LED chip, wherein the first redistribution layer and the second redistribution layer extend from the light-emitting region to the non-light-emitting region;
• wherein, in a top view, the package structure has a rectangle shape with a first side, a second side, a third side, and a fourth side different from each other;
• wherein the second redistribution layer of the first light-emitting unit extends toward the first side, the second redistribution layer of the second light-emitting unit extends toward the second side, and the second redistribution layer of the third light-emitting unit extends toward the third side.