Method for collective bending of microelectronic components including a transfer the microelectronic components then assembled to a temporary handle

A method for collective bending of microelectronic components, including the following steps:

• making an initial structure, including:
• a plurality of microelectronic components, having an upper face and an opposite lower face, spaced laterally apart from each other by a non-zero distance lt;
• a same temporary handle substrate, made of a rigid material, which extends continuously opposite the microelectronic components, and to which all microelectronic components are assembled by their upper face;
• providing a shaping support, having an upper face and an opposite lower face, the upper face including a plurality of bent surfaces surrounded by lateral walls;
• depositing an adhesive interlayer covering the lower face of the microelectronic components or the upper face of the shaping support;
• affixing the initial structure onto the shaping support, so that the microelectronic components rest and adhere at a support area of their lower face over an upper surface of the lateral walls;
• removing the temporarily handle substrate;
• bending the microelectronic components, so that they are curved, and adhere over the bent surfaces by the adhesive interlayer, the latter then being in contact with the lower face of each microelectronic component and of the corresponding bent surface;
• dicing the assembly thus obtained, so as to individualize the microelectronic components, each then being assembled to a portion of the shaping support.