Flexible substrates having semiconductor packages

An electronic device, comprising:

• a ball grid array (BGA) semiconductor package including:
• a semiconductor die;
• a plurality of conductive balls coupled to the semiconductor die, the plurality of conductive balls coupled to a bottom surface of the BGA semiconductor package;
• and
• a conductive terminal, where no conductive ball is formed, coupled to the semiconductor die and exposed to the bottom surface, the plurality of conductive balls extending farther away from the bottom surface of the BGA semiconductor package than the conductive terminal extends from the bottom surface of the BGA semiconductor package;
• and
• a flexible substrate having first and second ends opposing each other, the first end having a first conductive terminal coupled to the conductive terminal, the second end having a second conductive terminal adapted to be coupled to an electronic component, the first and second conductive terminals of the flexible substrate coupled to each other, wherein the flexible substrate has a bottom surface that does not extend farther away from the bottom surface of the BGA semiconductor package than the plurality of conductive balls extends from the bottom surface of the BGA semiconductor package.

An electronic device, comprising:

• a ball grid array (BGA) semiconductor package including:
• a semiconductor die electrically coupled to a plurality of conductive balls and a plurality of conductive terminals;
• and
• mold compound covering the semiconductor die, the plurality of conductive balls and the plurality of conductive terminals physically contacting a surface of the mold compound, a height of each of the plurality of conductive balls greater than a height of each of the plurality of conductive terminals;
• and
• a substrate including a plurality of terminals, each of the plurality of terminals attached to a corresponding one of the plurality of conductive terminals.

An electronic device, comprising:

• a semiconductor package including:
• a semiconductor die;
• a conductive ball electrically connected to the semiconductor die, the conductive ball physically contacting and extending from a bottom surface of the semiconductor package at a first height;
• and
• a conductive terminal electrically connected to the semiconductor die, the conductive terminal physically contacting and extending from the bottom surface of the semiconductor package at a second height;
• and
• a substrate including a first end and a second end, the first end including a first conductive terminal coupled to the conductive terminal of the semiconductor package, and the second end including a second conductive terminal adapted to be coupled to an electronic component, wherein a thickness of the substrate is less than the first height.