Image sensor with a bond pad
AssigneeSemiconductor Components Industries, LLC
InventorsMarc Allen Sulfridge, William Crofoot, Swarnal Borthakur
Life of this patent
Estimating the term…
Abstract
An image sensor may include a sensor chip that is bonded to an application-specific integrated circuit (ASIC) chip. A bond pad for the image sensor may be formed in the ASIC chip and exposed through a trench in the sensor chip. The image sensor may include a conductive light shield at a periphery of the image sensor to shield optically black pixels. An opaque layer may be formed over the conductive light shield to mitigate reflections off the conductive light shield. An anti-reflective layer may be formed over the pixel array. The anti-reflective layer may have a different thickness over the pixel array than in the trench for the bond pad.
Claims20
An image sensor with an array of imaging pixels, the image sensor comprising:
- a semiconductor substrate;
- photosensitive elements for the array of imaging pixels in the semiconductor substrate;
- color filter elements that overlap the photosensitive elements;
- at least one additional photosensitive element in the semiconductor substrate outside of the array of imaging pixels;
- a conductive light shield that overlaps the at least one additional photosensitive element;
- an opaque dielectric layer that overlaps the conductive light shield and the at least one additional photosensitive element;
- a planarization layer that overlaps both the color filter elements and the opaque layer;
- and
- microlenses that overlap the color filter elements, wherein the planarization layer is interposed between the color filter elements and the microlenses.
An image sensor with an array of imaging pixels, the image sensor comprising:
- a first chip with a first semiconductor substrate;
- photosensitive elements for the array of imaging pixels in the first semiconductor substrate;
- a second chip with a second semiconductor substrate, wherein the second chip is bonded to the first chip;
- a bond pad in the second chip that is exposed through a trench extending through the first chip;
- and
- an anti-reflective layer with a first portion that has a first thickness and a second portion that has a second thickness that is less than the first thickness, wherein the first portion overlaps the photosensitive elements.
Dependencies are inferred from the claim text.