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US 12,588,301 B2Granted
Detector architecture using photodetector substrates and semiconductor devices
AssigneeVarex Imaging Corporation
InventorsArundhuti Ganguly, Ivan P. Mollov, Richard E. Colbeth
Life of this patent
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Abstract
Some embodiments include a method, comprising: providing a semiconductor substrate including photodetectors on a first side of the substrate; attaching at least one semiconductor device to the first side of the semiconductor substrate; attaching a back support plate to the semiconductor substrate over the at least one semiconductor device; and thinning the semiconductor substrate.
Claims18
A method, comprising:
- providing a semiconductor substrate including photodetectors on a first side of the semiconductor substrate;
- attaching a plurality of semiconductor chips to the first side of the semiconductor substrate;
- attaching a back support plate to the semiconductor substrate over the plurality of semiconductor chips, the back support plate comprising a central protrusion and peripheral recesses extending around at least a portion of the central protrusion;
- and
- thinning the semiconductor substrate.
2 more elements
A method, comprising:
- providing a plurality of semiconductor substrates including photodetectors on a first side of each of the semiconductor substrates;
- attaching a second side of each of the semiconductor substrates to a first carrier substrate;
- attaching at least one semiconductor device to the first side of each of the semiconductor substrates;
- attaching a back support plate to the semiconductor substrates over the at least one semiconductor device;
- and
- thinning the semiconductor substrates.
3 more elements
A method, comprising:
- providing a semiconductor substrate comprising a plurality of photodetectors for detecting incident radiation;
- attaching a plurality of semiconductor chips for processing the detected incident radiation to the semiconductor substrate;
- attaching a back support plate for structurally supporting the semiconductor substrate to the semiconductor substrate, the back support plate comprising a central protrusion and peripheral recesses extending around at least a portion of the central protrusion;
- and
- thinning the semiconductor substrate;
- wherein the plurality of semiconductor chips are attached to the semiconductor substrate between the semiconductor substrate and the back support plate.
3 more elements
Dependencies are inferred from the claim text.