Fin trim plug structures with metal for imparting channel stress
AssigneeIntel Corporation
InventorsTao Chu, Feng Zhang, Minwoo Jang, Yanbin Luo, Chia-Ching Lin, Ting-Hsiang Hung
Life of this patent
Estimating the term…
Loading patent…
AssigneeIntel Corporation
InventorsTao Chu, Feng Zhang, Minwoo Jang, Yanbin Luo, Chia-Ching Lin, Ting-Hsiang Hung
Estimating the term…
Fin trim plug structures with metal for imparting channel stress are described. In an example, an integrated circuit structure includes a fin including silicon, the fin having a top and sidewalls, wherein the top has a longest dimension along a direction. A first isolation structure is over a first end of the fin. A gate structure including a gate electrode is over the top of and laterally adjacent to the sidewalls of a region of the fin. The gate structure is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end, the second isolation structure spaced apart from the gate structure along the direction. The first isolation structure and the second isolation structure both include a dielectric material laterally surrounding an isolated metal structure.
An integrated circuit structure, comprising:
A static-random access memory (SRAM) integrated circuit structure, comprising:
A computing device, comprising:
A computing device, comprising:
Dependencies are inferred from the claim text.