Semiconductor device and manufacturing methods thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorShahaji B. More
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorShahaji B. More
Estimating the term…
Epitaxial regions may be formed in specific locations on a semiconductor wafer with specific asymmetric properties such as slope or tilt direction, slope or tilt angle, and/or other asymmetric properties. The asymmetric epitaxial regions may be formed using various plasma-based fin structure etching techniques described herein. The specific asymmetric properties may increase metal landing coverage areas in particular locations on the semiconductor wafer (e.g., that are optimized for particular locations on the semiconductor substrate) to reduce the contact resistance between the epitaxial regions and associated conductive structures that are formed to the epitaxial regions. This increases semiconductor device performance, decreases the rate and/or likelihood of defect formation, and/or increases semiconductor device yield, among other examples.
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Dependencies are inferred from the claim text.