Enhanced fluid replacement structures for use in immersion cooling tanks

A fluid replacement structure for use in an immersion cooling tank that is configured to retain dielectric working fluid and that is also configured to retain a plurality of computing devices that are submerged in the dielectric working fluid, the fluid replacement structure comprising:

• a side portion that is configured to be directly attached to a motherboard of a computing device, the motherboard also comprising a first heat-generating component;
• a body portion;
• a chamber in the body portion of the fluid replacement structure, wherein the first heat-generating component is located in the chamber when the fluid replacement structure is attached to the motherboard;
• and
• a channel in the body portion of the fluid replacement structure, the channel being configured to direct vaporized working fluid away from the first heat-generating component to an outer portion of the fluid replacement structure when the motherboard is submerged in the dielectric working fluid and the first heat-generating component is in operation.

A fluid replacement structure for use in an immersion cooling tank that is configured to retain dielectric working fluid and that is also configured to retain a plurality of computing devices that are submerged in the dielectric working fluid, the plurality of computing devices comprising components that have a thermal limit for safe operation, the fluid replacement structure comprising:

• a first chamber;
• a second chamber;
• a membrane separating the first chamber and the second chamber, the membrane having a melting point that is greater than a boiling point of the dielectric working fluid and less than the thermal limit of the components in the plurality of computing devices;
• a first substance within the first chamber;
• and
• a second substance within the second chamber, wherein the first chamber is positioned above the second chamber in the fluid replacement structure, wherein the second substance has a lower density than the first substance,-wherein melting of the membrane causes the first substance to mix with the second substance, and wherein mixing the first substance and the second substance causes an endothermic reaction to occur that lowers a temperature of the dielectric working fluid in the immersion cooling tank.