GDDR memory expander using CMT connector
AssigneeIntel Corporation
InventorsXiang Li, Konika Ganguly, Tongyan Zhai, George Vergis, Anthony M. Constantine, Jun Liao
Life of this patent
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Abstract
Methods and apparatus for GDDR (Graphics Double Date Rate) memory expander using compression mount technology (CMT) connectors. A CMT connector with a dedicated pinout for GDDR-based memory is provided that enables end users and manufacturers to change the amount of GDDR memory provided with a GPU card, accelerator card, or apparatus having other form factors. Memory could also be replaced in the event of a failure. In addition, embodiments are disclosed that support a split channel concept where there could be multiple devices (e.g., GDDR modules) with dedicated signals routed to each module.
Claims20
A card comprising:
- a printed circuit board (PCB) having a plurality of components and circuitry mounted or operationally coupled thereto and including one or more arrays of compression mount technology (CMT) contact pads;
- a processor, operatively coupled to the PCB, the processor having pins or pads that are electrically coupled to CMT contact pads in the one or more arrays of CMT contact pads via wiring in the PCB;
- and
- one or more CMT Graphic Double Data Rate (GDDR) modules, each including a plurality of GDDR memory devices mounted to a substrate, the GDDR memory devices communicatively coupled via wiring in the substate to an array of CMT contact pads formed on an underside of the substrate;
- wherein each of the one or more CMT GDDR modules is communicatively coupled to the PCB via a respective CMT connector interposed between the CMT GDDR module and the PCB proximate to an array of CMT contact pads on the PCB.
An apparatus, comprising:
- a printed circuit board (PCB) having a plurality of components and circuitry mounted or operationally coupled thereto and including one or more arrays of compression mount technology (CMT) contact pads;
- a processor, operatively coupled to the PCB, the processor having pins or pads that are electrically coupled to CMT contact pads in the one or more arrays of CMT contact pads via wiring in the PCB;
- and
- a first CMT Graphic Double Data Rate (GDDR) module including a plurality of GDDR memory devices and an on module CMT connector;
- a CMT connector interposed between the first CMT GDDR module and the PCB proximate to the one or more arrays of CMT contact pads on the PCB;
- and
- a second CMT GDDR module, operatively coupled to the on module CMT connector of the first CMT GDDR module.
An apparatus, comprising:
- a substrate to which multiple GDDR memory devices are mounted, the substrate having first and second arrays of CMT contact pads on an underside thereof;
- first wiring in the substrate communicatively coupling the GDDR memory devices to CMT contact pads in the first array of CMT contact pads;
- an on module CMT connector mounted to the substrate and having an array of spring-loaded contacts or pins extending above a top surface thereof;
- and
- second wiring in the substrate coupling the spring-loaded contacts or pins to CMT contact pads in the second array of CMT contact pads.
Dependencies are inferred from the claim text.