High-frequency electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsHirofumi Oie, Ikuo Deguchi
Life of this patent
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Abstract
A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate but do not protrude from this side surface, and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes at least partially overlap each other in a thickness direction of the ceramic multilayer substrate, with a distance in the thickness direction between the overlapping ground electrodes being 5 μm or greater.
Claims7
A high-frequency electronic component comprising:
- a ceramic multilayer substrate;
- ground electrodes provided at different layers of the ceramic multilayer substrate;
- and
- a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate,
- the ceramic multilayer substrate including a first main surface and a second main surface opposite to each other in a thickness direction of the ceramic multilayer substrate,
- the second main surface being a main surface to be a mounting surface,
- two or more of the ground electrodes being exposed to the side surface of the ceramic multilayer substrate and protruding from the side surface, and being electrically connected to the shielding film,
- on the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes including a first ground electrode and a second ground electrode, the first ground electrode being provided at a layer closest to the first main surface among the layers provided with the respective ground electrodes and protruding from the side surface of the ceramic multilayer substrate, and the second ground electrode being provided at a layer next closest to the first main surface among the layers provided with the respective ground electrodes,
- the first ground electrode protruding from the side surface of the ceramic multilayer substrate at a maximum protruding amount of a (μm),
- in a side view of the ceramic multilayer substrate, a minimum distance between the first ground electrode and the second ground electrode being 30.5a+5 (μm) or greater.
Dependencies are inferred from the claim text.