Radio frequency transmission circuit board and manufacturing method thereof

A radio frequency transmission circuit board, having a bending portion, a signal transmitting portion and a signal receiving portion, wherein the bending portion is respectively connected to and is located between the signal transmitting portion and the signal receiving portion, and the radio frequency transmission circuit board comprises:

• a first multilayer structure, comprising:
• a first dielectric layer;
• and
• two first metal layers, wherein the first dielectric layer is respectively connected to and is located between the two first metal layers;
• a second multilayer structure, comprising:
• a second dielectric layer;
• and
• a second metal layer arranged on the second dielectric layer;
• a third multilayer structure, comprising:
• a third dielectric layer;
• and
• a third metal layer arranged on the third dielectric layer;
• a first bonding layer arranged between the first multilayer structure and the second multilayer structure, and bonding one of the two first metal layers to the second dielectric layer;
• a second bonding layer arranged between the first multilayer structure and the third multilayer structure, and bonding the other of the two first metal layers to the third dielectric layer;
• a blind hole extends from the second metal layer to the first dielectric layer, wherein a reflective layer is arranged at a bottom end of the blind hole;
• a lens embedded in the first multilayer structure, wherein the lens is partially exposed in the blind hole;
• an active component electrically connected to the second metal layer and aligned with the blind hole;
• a chip electrically connected to the second metal layer;
• an optical fiber embedded in the first multilayer structure, wherein the optical fiber has a first end and a second end opposite to the first end, and the first end is connected to the lens;
• an optoelectronic coupling component embedded in the first multilayer structure and connected to the second end of the optical fiber, wherein the optoelectronic coupling component is electrically connected to the one of the two first metal layers;
• and
• an antenna component electrically connected to the one of the two first metal layers;
• wherein the bending portion does not comprise the second multilayer structure and the third multilayer structure;
• wherein the blind hole, the lens, the active component and the chip are located in the signal transmitting portion, the optical fiber is located in the bending portion, and the optoelectronic coupling component and the antenna component are located in the signal receiving portion.