Thermal management system and optical bench for diode laser device

A diode pump module comprising:

• a plurality of thermo-optical ground planes, wherein each of the plurality of thermo-optical ground planes comprises:
• a diode laser device;
• a first plate configured to mount the diode laser device defining a first surface area;
• a second plate;
• a body positioned between the first and second plates, the body comprising a plurality of posts to support the first and second plates and to stiffen the first plate;
• an evaporation chamber defined between the body and the first plate, wherein the evaporation chamber is configured to receive a working fluid, the evaporation chamber comprising a porous medium to hold the working fluid, wherein the evaporation chamber and the first plate are in thermal communication to transfer heat from the evaporation chamber to the first surface area of the first plate, and wherein inner walls of the evaporation chamber define a second surface area that is greater than the first surface area of the diode laser device;
• and
• a channel defined between the body and the second plate, wherein the channel is configured to receive and circulate a coolant at a predetermined flowrate, the channel positioned adjacent to and in thermal communication with the evaporation chamber to transfer heat from the evaporation chamber to the circulating coolant;
• and
• an optical device attached to the first plate, wherein the optical device is in optical communication with an output of the diode laser device;
• and
• a flow manifold structure configured to connect each of the plurality of thermo-optical ground planes in a predetermined configuration to combine optical power from each of the diode laser devices of the plurality of thermo-optical ground planes and to couple the combined optical power to a single optical fiber, the flow manifold structure comprising:
• a manifold inlet tube configured to receive the coolant;
• a distribution manifold fluidically coupled to the manifold inlet tube and fluidically coupled to each channel of the plurality of thermo-optical ground planes;
• a return manifold fluidically coupled to each channel of the plurality of thermo-optical ground planes;
• and
• a common manifold outlet fluidically coupled to the return manifold.

A thermo-optical ground plane, comprising:

• a first plate configured to mount a diode laser device defining a first surface area;
• a second plate;
• and
• a body positioned between the first and second plates, the body defining:
• a plurality of posts to stiffen the first plate;
• an evaporation chamber in thermal communication with the first plate, wherein the evaporation chamber is configured to receive a working fluid, and wherein inner walls of the evaporation chamber define a second surface area that is greater than the first surface area of the diode laser device;
• and
• a channel defined in thermal communication with the evaporation chamber, wherein the channel is configured to receive and circulate a coolant fluid at a predetermined flowrate, wherein the evaporation chamber and the channel are fluidically isolated.