Antenna package using ball attach array to connect antenna and base substrates
AssigneeIntel Corporation
InventorsJimin Yao, Robert L. Sankman, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang
Life of this patent
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Abstract
In accordance with disclosed embodiments, there is an antenna package using a ball attach array to connect an antenna and base substrates of the package. One example is an RF module package including an RF antenna package having a stack material in between a top and a bottom antenna layer to form multiple antenna plane surfaces, a base package having alternating patterned conductive and dielectric layers to form routing through the base package, and a bond between a bottom surface of the antenna package and to a top surface of the base package.
Claims20
An electronic assembly, comprising:
- an antenna package comprising multiple antenna plane surfaces, wherein the multiple antenna plane surfaces include a stack material in between a top and a bottom antenna layer;
- a base substrate comprising multiple horizontal layers comprising a dielectric material, wherein individual horizontal layers include layers of patterned conductive material;
- and
- a bond between a bottom surface of the antenna package and a top surface of the base substrate.
A communication device, comprising:
- an electronic assembly;
- and
- a circuit board coupled to the electronic assembly,
- wherein the electronic assembly includes:
- a radio frequency (RF) antenna package comprising antenna patches in multiple antenna layers, and further comprising a first dielectric material separating an antenna patch in a top antenna layer of the multiple antenna layers and an antenna patch in a bottom antenna layer of the multiple antenna layers,
- package substrate comprising:
- a second dielectric material,
- a plurality of layers extending through the second dielectric material and being parallel to the antenna patches, wherein the plurality of layers include conductive traces embedded in the second dielectric material, and
- conductive vias extending in a direction perpendicular to the antenna patches between two or more layers of the plurality of layers, and
- a bond between a bottom surface of the RF antenna package and a top surface of the package substrate.
A method of fabricating an electronic assembly, the method comprising:
- providing an antenna package comprising antenna patches in a plurality of antenna layers and a first dielectric material between a top antenna layer of the plurality of antenna layers and a bottom antenna layer of the plurality of antenna layers;
- providing a base substrate comprising horizontal layers of a second dielectric material, wherein two or more of the horizontal layers include sub-layers comprising conductive material;
- and
- providing a bond between a surface of the antenna package and a surface of the base substrate.
Dependencies are inferred from the claim text.