Multilayer electronic component

A multilayer electronic component, comprising:

• a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer;
• and
• an external electrode disposed on the body,
• wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion,
• wherein the first plating portion includes a first Ni layer in direct contact with the electrode layer, an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni or Sn, and a first Sn layer disposed on the intermetallic compound layer, and
• wherein the second plating portion includes a second Ni layer in contact with the first plating portion.