Multilayer ceramic electronic component and manufacturing method thereof

A multilayer ceramic electronic component comprising:

• a ceramic element having
• a multilayer body in which a plurality of internal electrodes are stacked with interposition of a dielectric layer and the internal electrodes are led out in a direction orthogonal to a stacking direction, and
• a protective part that is located at least on upper and lower surfaces of the multilayer body in the stacking direction and is formed of a ceramic layer;
• an underlying electrode layer formed at least on part of a surface of the protective part on either one or both of upper and lower sides in the stacking direction;
• a covering layer that is continuous with the ceramic layer of the protective part near the underlying electrode layer and covers an end part or a rim part of the underlying electrode layer;
• a plating layer that covers at least an upper surface of the underlying electrode layer;
• and
• at least a pair of external electrodes that have the underlying electrode layer and the plating layer and are electrically connected to the internal electrodes,
• wherein, at least in a boundary region with the covering layer in the protective part on which the external electrode is not formed, a position of the surface of the protective part on which the external electrode is not formed in the stacking direction is located on a side of the multilayer body relative to a position of a boundary line between the underlying electrode layer and the protective part in the stacking direction.